Ever had an unexpected product failure? I think it is safe to assume that any company producing products containing electronic components has experienced a crash or two. Our high-magnification X-Ray inspection system enables us to investigate these issues and accurately identify board deficiencies. We can check for solder voids, opens, shorts, insufficient reflow, and explore possible manufacturer’s component and board defects. Our x-ray inspection equipment is priceless when troubleshooting a failure. The x-ray findings are instrumental in determining the source of the fault, and the data provided will not only assist you in the formulation of an efficient solution, it often results in process and product enhancements.
Typical failures include; missing components, misaligned components, opens, shorts (bridges) excessive or insufficient solder, and reflow problems.
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